Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) PDF 電子書籍 フリー

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) PDF 電子書籍 フリー

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) PDF 電子書籍 フリー, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) , オンラインで書籍をダウンロードする Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) PDF 電子書籍 フリー 無料で, 本の無料読書 Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) オンライン, あなたは無料で、余分なお金を費やす必要なしに(PDF、epub)形式でここにこの本をダウンロードすることができます。以下のダウンロードリンクをクリックして、 Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) 書籍のPDFまたはエパブ無料

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace ... Engineering Systems) (English Edition)
書籍の説明

  • ファイル名: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace … Engineering Systems) (English Edition) PDF 電子書籍 フリー.
  • ISBN : 55811927
  • リリース日 : 18 8月 2019
  • ページ数 : 32 ページ
  • 著者 : Juan Cepeda-Rizo
  • 作成者情報 : Juan Cepeda-Rizo
  • エディター : 独立した出版社

 

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書籍の説明

商品の説明
著者について
Juan Cepeda-Rizo obtained his bachelor’s degree in mechanical engineering and master’s in materials engineering from Cal Poly, San Luis Obispo in 1997. After graduation he worked for a semiconductor company doing electronic packaging analysis. He received his Ph.D. from Claremont Graduate University in Applied Mathematics in and in 2008 worked for NASA’s Jet Propulsion Laboratory as a thermal system engineer where his latest responsibilities included thermal and structural analysis of flight electronics.

Jeremiah Gayle obtained his bachelor’s degree in mechanical engineering from Arizona State University, and master’s degrees from Iowa State, and John Hopkins University in space systems engineering. He is pursuing a doctorate in aerospace engineering from Colorado State University and works at NASA’s Jet Propulsion Laboratory where he works on spacecraft systems and conducts thermal and structural analysis of avionics.

Joshua Ravich is a supervisor for the Technology Infusion group at JPL, where he works on the mechanical design and analysis of spacecraft systems. His recent work has included the Mars Helicopter project. He received a bachelor’s degree in mechanical Engineering from UC Berkeley and a master’s in mechanical and aerospace engineering from the University of Michigan.

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